A facility to fabricate Hi-Rel electronic boards and assemblies  for ground and space applications is operationalized at SCL.

The work involves precision mounting of micro-electronic devices, electronic & mechanical components, soldering, local potting, conformal coating, connector assembly and harnessing etc. as per ISRO- PAX-300 workmanship standards.

Materials used for fabrication of the Hi-Rel boards are drawn from a Preferred Materials List (PML) or Project Approved Material List (PAML). This ensures that all boards fabricated meet the performance and reliability criteria applicable for the mission life and other  requirements as specified.
 

Quality control measures are taken to fabricate Hi-Rel cards free of manufacturing defects. QA audits are applied at appropriate points.

The fabrication facility is located in an ESD-safe clean-room area meeting all other environmental conditions. All personnel involved in the fabrication work are trained and certified as per workmanship standards.