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Wafer Fab is housed in immaculately maintained
Clean Rooms of about 24,000 sqft comprising of Class 10 to Class
1000. Abutting the Clean Room is an additional un-facilitized space
identified for Clean Room expansion. Production support equipment
and utilities are housed in Clean Room Sub-Fab.
Clean Room Specifications
The Clean
Room contains a segregated diffusion area, etch, photolithography,
metallization and Implantation bays. Clean Room laminar airflow is
from an ULPA filter ceiling to raised floor, through perforated
tiles and through the raised
floor space to the side wall air
returns. The air rises to the return air plenum and back to the recirculating air handlers
(RAHs) located on the sub-Fab. Make-up
air is mixed in the RAHs before being introduced to the supply air
ducts
above the ULPA filters.
All services are fed to the Fab from the sub-Fab through the cut
outs in Waffle slab and through the raised floor.
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Clean Room Type |
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Bay and Chase configuration |
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Cleanliness specification |
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Class 10 to Class
100 (Class 4 to Class 6 as per ISO 146441) |
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Ceiling height (Clean Room) |
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10 feet (3.00m) |
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Raised Floor height |
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2 feet (600mm) |
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Floor Type |
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Pedestal and perforated tile |
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Sub-Fab height |
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~18 feet (5.4m) |
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Air velocity at ULPA filter |
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90 ± 20 fpm |
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No. of Air changes (designed) |
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Upto 9/min. |
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Recovery |
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< 6 sec. |
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Clean Room parameters such as temperature,
humidity, pressurization are continuously monitored and controlled
through a microprocessor based Facilities Control and Monitoring
System (FCMS). A centralized particulate Monitoring Systems
constantly monitors the particulate level in the Clean Room.
Regular Testing of the Clean Room is done as per the periodicity
stipulated in ISO 146441 to ensure adherence to designed cleanliness
level. |
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